Engineering objective
Study a modular sensor package intended to reduce integration changes when carried by different host platforms.
Proposed design
The capstone concept discusses Arduino UNO R4 or STM32 control, I²C/SPI module connections, replaceable sensors, regulated power, and interface definitions. Planned phases include requirements, PCB and firmware development, bench integration, and verification.
Status
This was a proposal rather than a completed build. Its significance lies in interface design and systems-engineering feasibility analysis.